Workshop - High Temperature and Radiations – Hard Electronics Using Nanomechanical Relays

2 July 2026, 9:00–12:30 GMT, Cambridge, UK

This workshop is part of the IMAPS-UK E4EE conference

This workshop will explain how our silicon Switch NEMS technology has the potential to create low power chips for extreme temperatures (0K-350C) or high radiation (to 10 Mrad).

Our NEM switches comprise tiny silicon beams that are actuated electrostatically, and can implement efficient logic circuits as well as non-volatile memory, and be seamlessly integrated with CMOS.

The workshop will cover applications areas where NEM switch technology offers transformational potential, manufacturing methods, design techniques, functional testing and reliability evaluation.

We will share details of how we achieve high-density single-chip implementation of NEMS and CMOS using advanced 3-D integration methods, and how circuits and systems can be designed using a custom process design kit.

Some case studies comprising NEM prototype circuits for edge applications will be discussed, including opportunities for reducing device count compared to CMOS.

Results from functional testing and reliability evaluation including shock and vibration testing will be presented.

 

Programme of the webinar

All times are in GMT
9:00WelcomePiers Tremlett (Microhip-UK), Jens Bolten (AMO)
9:15Introduction
  • Why NEMS Switch Technology ?
Piers Tremlett (Microhip-UK)
9:45Manufacturing methods
  • Fabrication
  • Intergation
Jens Bolten (AMO), Simon Bleiker (KTH)
10:30Coffee break
11:00Design techniques
  • Capacity: HT, radiation, low energy (zero leakage)
  • Architectures
  • Algorithms
Dinesh Pamunuwa (UNIVBRIS)
11:45Testing and Reliability
  • Functional testing
  • Reliability testing
Ivan Marozau (CSEM), Dinesh Pamunuwa (UNIVBRIS)
12:30End of the workshop
 

Registration information

 

Speakers

Piers Tremlett
Microchip Technology
Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing and Technology. He is Microsemi’s senior Microelectronics Packaging Specialist with experience in System in a Package, PCB embedded die and high temperature electronics packaging.

Dr. Dinesh Pamunuwa
Bristol University

Dr. Dinesh Pamunuwa (M) received a BSc degree in Electrical and Electronic Engineering from the University of Peradeniya, Peradeniya, Sri Lanka in 1997, and a PhD in Electronic System Design from Royal Institute of Technology (KTH), Sweden in 2003. He interned at the Berkeley Research Labs of Cadence Design Systems in Berkeley, USA during his PhD, working on timing and signal integrity analysis in integrated circuits and worked as a consultant for them afterwards. In 2000 he cofounded an electronics and software consultancy company based in Sweden and Sri Lanka. In May 2004, he was appointed to a Lectureship at Lancaster University and made a Senior Lecturer in 2010. Since 2011 he has been Professor of Electronic Engineering at the School of Electrical, Electronic and Mechanical Engineering at UNIVBRIS. He has extensive experience in FPGA and processor systems architectures and modelling, NEM switch-based systems analysis and synthesis and electronic design automation (EDA) tools.

Jens Bolten
Microchip Technology

Dr. Jens Bolten (M) obtained both his diploma and his PhD in electrical engineering from Rheinisch-Westfälische Technische Hochschule (RWTH) Aachen, Germany. In 2006 he jonied AMO as a research engineer and is currently head of AMO´s nanostructuring team. His research focusses on high resolution electron beam lithography for electronic devices and the investigation of process integration, both with respect to a heterogeneous processing environment and to the integration of novel materials into pre-existing process modules and flows. He will oversee the process development and integration at AMO on a day-to-day basis.

Dr. Ivan Marozau
CSEM

Dr. Ivan Marozau (M) received his PhD in materials science from ETH Zurich (Switzerland) in 2009. Since 2015 he joined the “Materials science and Component Reliability” sector at CSEM as R&D engineer. He is responsible for the reliability testing and failure mode analysis activities at CSEM. He has an experience in reliability testing of MEMS and MOEMS components, their characterisation and failure mode analysis. In this project he will perform functional testing and reliability assessment of NEMS-based components

Simon Bleiker
KTH

Simon J. Bleiker received his M.Sc. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH) in Zurich, Switzerland in 2012 and his Ph.D. degree from the Royal Institute of Technology (KTH) in Stockholm, Sweden in 2017. His expertise lies in 3D-integration and packaging of MEMS and NEMS technology. Simon has published major contributions in the fields of nano-electromechanical switches, low temperature wafer bonding, self assembly, and through-silicon vias (TSVs). Currently, he is continuing his research on NEM switches and 3D integration in the department of Micro and Nanosystems at KTH Stockholm.

i-EDGE has received funding from the European Union (grant number 101092018), the Swiss State Secretariat for Education, Research and Innovation (SERI) and UK Research and Innovation (UKRI) under the UK government's Horizon Europe funding guarantee (grant numbers 10061130 and 10063023).

Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union, European Health and Digital Executive Agency (HADEA), SERI or UKRI. Neither the European Union nor the granting authorities can be held responsible for them.

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